The chip communicates with the Southbridge or PCH using these lines: Multiplexed command, address, and data lines. LFRAME#: Indicates the start of an LPC bus cycle. LCLK: LPC clock input (typically 33 MHz). 3. System Management Signals
The primary application for this chip is within laptop motherboards. It is a critical component for:
: Provides inventory status and basic technical documentation. The Datasheet Archive
Battery backup supply used to maintain internal registers when main power is disconnected. VSS / AVSS: System ground reference. 2. LPC (Low Pin Count) Interface winbond wpce773la0dg datasheet pdf download 2021
The 128-pin LQFP package distributes its pins into specific functional clusters required for modern computing platforms:
In typical laptop architectures, the operates downstream from the primary platform hub (such as an Intel ICH9M southbridge). It actively mediates power delivery and auxiliary signals.
The Winbond is an Embedded Controller (EC) primarily used in laptop motherboards (such as those for Dell, Acer, and HP) to manage keyboard functions, power sequencing, and thermal monitoring. While Winbond originally manufactured this series, the product line was later transitioned to Nuvoton Technology . 📄 Datasheet Download & Resources The chip communicates with the Southbridge or PCH
This document is a compiled research summary for informational purposes only. It does not replace the official manufacturer’s datasheet. All specifications should be verified from the original Winbond/Nuvoton documentation before use in design.
While the datasheet is comprehensive, field experience reveals additional quirks:
Precise mapping of the 128 pins, crucial for soldering and designing PCB layouts. The Datasheet Archive Battery backup supply used to
Why specifically the ? Semiconductor datasheets are updated to correct timing diagrams, add application notes, or clarify power-up sequences.
Disclaimer: Ensure you scan any downloaded PDFs with reputable antivirus software. Conclusion
The chip operates as a critical bridge between the primary CPU, system BIOS, and peripheral low-speed motherboard systems. Though historically branded by Winbond Electronics Corporation, production and product lines for sections of these legacy I/O portfolios are supported under Nuvoton Technology Corporation America. Specification Detail
In conclusion, downloading the Winbond WPCE773LA0DG datasheet PDF is a straightforward process that can be completed in a few steps. By following this guide, you can obtain the datasheet and access detailed information about the microcontroller, enabling you to design and develop your project with confidence.